| Mechanical Engineer at Remote, Remote, USA |
| Email: [email protected] |
| From: Abhay, STM Consulting, Inc. [email protected] Reply to: [email protected] Electronic Packaging / Mechanical Engineer Phoenix, AZ, USA Grand Rapids, MI, USA Duration- 6-12 Months CTH Job Requirements Job Description: Electronic Packaging / Mechanical Engineer We are currently seeking a highly skilled and experienced Electronic Packaging / Mechanical Engineer to join our team at Quest Global. In this role, a successful candidate will be responsible for performing the mechanical engineering activities related to the design, analysis, documentation, processing, fabrication, assembly and qualification of electronic packaging. Responsibilities: Work closely with cross-functional teams in the development of new solutions. Strong engineering fundamentals and analytical background with the ability to understand and guide analyses and offer solutions related to mechanical, and electro-mechanical systems. Types of analysis include thermal, fluid, structural, and power. Develop and maintain traceability matrices to ensure all customer requirements are met throughout the design and development process. Familiarity with DO-160 and equivalent MIL-STD-810 tests to ensure the processor CCA can withstand environmental challenges such as salt fog and fluid susceptibility. Create complex mechanical designs and execute layouts for multiple products Demonstrated ability in packaging electrical components such as Circuit Cards, Connectors, and cables, including design, integration and validation in rugged environments including ground & avionics Demonstrated ability in developing, integrating, and validating mechanical, and electro-mechanical designs Lead the mechanical design, prototyping, testing, and troubleshooting of designs Experience in the design of additive manufactured parts, machined parts, weldments, sheet metal parts, and cable assemblies Lead thermal, vibration, and electrical bonding analyses to ensure the integrity and reliability of the processor CCA. Conduct design to cost initiatives to optimize product value while maintaining performance standards. Collaborate with cross-functional teams to integrate mechanical engineering perspectives into overall product development. Work Experience Requirements: Bachelors degree in mechanical engineering or a related field; Masters degree preferred. Minimum of 6 years of experience in mechanical engineering, specifically in the aerospace or defense industry. Experience with electronics packaging Proven track record of successful mechanical design and analysis in processor CCA development. Strong understanding of thermal dynamics, structural analysis, and electrical bonding principles. Experience with design to cost strategies and customer requirement traceability. Proficient in using CAD software and engineering analysis tools. Knowledge of DO-160, MIL-STD-810, MIL-STD-461, and other relevant military and aerospace standards. Familiarity with hermetic package design a plus Excellent problem-solving skills and the ability to work independently or as part of a team. Strong communication and documentation skills, with the ability to convey complex technical information effectively. Design for Manufacturability and Assembly (DFM/DFMA) experience Keywords: Arizona Michigan Mechanical Engineer [email protected] |
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| Thu Nov 07 19:52:00 UTC 2024 |