Chip Packaging Engineer at Mountain View, California, USA |
Email: [email protected] |
From: Abhishek, Vbeyond [email protected] Reply to: [email protected] Hi, Hope you are doing great. I would like to check your interest & availability for the below-mentioned position. If you are interested kindly reply back to me with your updated resume, contact details & the best time to reach you. Job Description: ROLE : Chip Packaging Engineer LOCATION : Mountain View, CA (Onsite) TYPE : Contract/Full-time Candidate Roles and Responsibilities 5+ years experience completing layouts of high pin count, multi-layer organic build-up packages using Cadence APD and SiP package design tools. Creating die and BGA symbols from scratch or from spreadsheet inputs Setting up design environment, including tech files, stack ups, and constraints Setting up Constraint Manager from scratch for complex packages (diff pair creaton, multiple power supplies, net and zone-specific constraints. Routing signals and matching length both manually and using tool features Design file management and documentation from initiation to final signoff Generation of POD Solid knowledge of top package suppliers design rules and basic manufacturing practices Desired experience Experience with Cadence Orbit I/O 2.5D interposer design layout experience using Cadence SiP Experience with Virtuoso and/or Innovus for 2.5D interposer design Experience with Synopsys tools for 2.5D interposer design Experience writing and implementing custom scripts in Cadence tools Familiar with Cadence PVS "Packaging", "Package Designer" , " APD " , Virtuoso , Innovus ,Cadence , BGA ,Bond ,Bum Education: Bachelors Degree Do you have time to jump on a call Id love to hear more about your background, your current projects, and your career aspirations... and of course, tell you more about our Client. Looking forward to hearing from you soon. Regards Abhishek Rajpoot US Recruitment Executive | VBeyond Corporation New Jersey, USA |Website : www.vbeyond.com Keywords: computer associates |
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Thu Dec 22 22:13:00 UTC 2022 |