| SAP Product Lifecycle// Remote with up to 50% travel (Travel expenses will be covered by HCL) at Remote, Remote, USA |
| Email: [email protected] |
| Title: SAP Product Lifecycle Location: Remote with up to 50% travel (Travel expenses will be covered by HCL) Rate: 9 0/hr Visa: USC/ GC only JOB Description: Experience in Material Master, Bill Of materials in ECC and MDG Engineering change records Document Management Equipment Master Areospace experience. Pankaj Singh US IT Recruiter m: 669-842-4964 EXT 644 w: www.e-solutionsinc.com e: [email protected] Disclaimer: E-Solutions Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, sexual orientation, gender identity or expression, national origin, age, disability, genetic information, marital status, amnesty, or status as a covered veteran in accordance with applicable federal, state and local laws. We especially invite women, minorities, veterans, and individuals with disabilities to apply. EEO/AA/M/F/Vet/Disability. -- Keywords: information technology green card |
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| Mon Sep 18 19:58:00 UTC 2023 |